| Assembly |
Soldering |
| • |
Automated Through-Hole |
• |
Selective |
| • |
Through-Hole Reflow (THR) |
• |
No Clean Process |
| • |
Paste & Glue Bottom Side (SMD) |
• |
Lead Free Hi Temperature |
| • |
Pin Insertion (Press Fit Pin) |
• |
Nitrogen Wave |
| • |
Compliant Pin (Press Fit Connector) |
• |
Nitrogen Reflow |
| • |
Conformal Coating - Spray & Dip |
• |
Soldering Point |
| • |
Potting |
|
|
| • |
Vibration Welding |
Reflow |
| • |
Preforming |
• |
2 Sided SMT Reflow |
| • |
Cable and Harness Assembly |
• |
Nitrogen SMD Reflow |
| • |
Box Build |
• |
Lead Free |
| • |
Subassembly and System Build |
|
|
| |
|
Depaneling |
| Pick and Place |
• |
Router |
| • |
0201,0402, and 0603 |
• |
V-Cut |
| • |
12, 16, and 20 Mil Pitch |
• |
Punch |
| • |
BGA and Mini BGA |
|
|
| • |
Pin In Paste |
Inspection |
| |
|
• |
Automated Optical (AOI) |
| Screen Printing |
• |
Automated X-Ray (AXI) |
| • |
Step Stencil (Cross Over) |
• |
2D Automated Solder Paste |
| • |
Lead Free |
• |
3D Automated Solder Paste |
| |
|
• |
Offline X-Ray |
| Flux Application |
• |
Cross Section |
| • |
Spray and Adhesives |
• |
Coordinate Measuring Machine |
| • |
Ultrasonic VOC |
|
|
| |
|
Rework |
| Testing |
• |
BGA Rework Station |
| • |
Electromechanical Assembly & Test |
|
|
| • |
Electronic Assembly and Test |
General |
| • |
Leak Test |
• |
High Volume Flash Programming |
| • |
Strain Test |
• |
Labeling |
| |
|
• |
Packaging |
| |
|
• |
Lean Line Design Ability |
