| Screen Printing |
| • |
Closed
Head |
| • |
Step Stencil
(Cross Over) |
| • |
Lead Free |
|
| Pick
and Place |
| • |
0201, 0402 and
0603 |
| • |
12, 16 and 20
Mill Pitch |
| • |
BGA and Mini
BGA |
| • |
MCM (Multi Chip
Module) |
|
| Chip
Encapsulation |
| • |
Under Fill |
| • |
Dam and Fill |
| • |
Glop Top |
|
| Flux
Application |
| • |
Spray |
| • |
Wave |
| • |
Ultrasonic VOC |
| • |
Free Flux |
|
| Soldering |
| • |
Robotic (Point) |
| • |
Robotic (Soft
Beam) |
| • |
Selective |
| • |
No Clean Process |
| • |
Lead Free Hi
Temp |
| • |
Nitrogen Wave |
| • |
Nitrogen Reflow |
| • |
Soldering (Point) |
| • |
Hot Bar Soldering |
|
| Reflow |
| • |
2 Sided SMT
Reflow |
| • |
Nitrogen SMD
Reflow |
| • |
Lead Free |
|
| Cleaning & Cleanliness |
| • |
Class
100K Environment |
| • |
Class 10K Environment
(Clean Room) |
| • |
Aqueous Clean |
| • |
Plasma Etch |
| • |
Chemical Clean,
Batch |
| • |
Cleaning |
|
| Depaneling |
| • |
Router |
|
| Traceability |
| • |
Automated Labeling |
| • |
CO2 Laser Marking |
| • |
YAG Laser Marking |
|
| Rework |
| • |
BGA Rework Station |
|
| COB
(Chip on Board) |
| • |
Wire Bonding |
| • |
Flip Chip |
| • |
Die Stacking |
|
| Medical |
| • |
Reagent Assembly |
| • |
Reagent Bottling |
| • |
Labeling |
| • |
Packaging |
| • |
Powder Formulation |
| • |
Tablet Compression |
| • |
Tablet Bottling |
| • |
Instrument Assembly |
| • |
Instrument Kit
Assembly |
| • |
Instrument Spares
Field Support |
| • |
Turnkey Medical
Builds |
|
| Inspection |
| • |
AOI (Automated
Optical) |
| • |
AXI (Automated
X-Ray) |
| • |
2D Automated
Solder Paste |
| • |
3D Automated
Solder Paste |
| • |
Offline X-Ray |
| • |
Coordinate Measuring
Machine |
|
| General |
| • |
Aluminum
Wire Bonding |
| • |
Potting |
| • |
Conformal Coating
Spray & Dip |
| • |
Liquid Gasket
Application |
| • |
Low Pressure
Molding |
| • |
Automated Through-Hole
Assembly |
| • |
Pin Insertion
(Press Fit Pin) |
| • |
Compliant Pin
(Press Fit Connector) |
| • |
THR (Through-Hole-Reflow) |
| • |
Paste & Glue
Bottom Side SMD |
| • |
Automated Robotic
Assembly |
| • |
Flex Substrate
Assembly |
| • |
Screen Print
Adhesives |
| • |
High Volume
Flash Programming |
| • |
Laser Trimming |
| • |
Heat Insertion/Staking |
| • |
Ultrasonic Welding |
| • |
Cable & Harness
Assembly |
| • |
Thermal Profiling |
| • |
Touch Screen
Integration |
| • |
Electromechanical
Assembly & Test |
| • |
Electronic Assembly
and Test |
| • |
CNC Milling
Machine |
|
